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Equipment overview:
This machine is seven-axis double face mill grinding machine, the grinding heads are finished by U1、W1、U2、W2 、U3、W3 axis, six grinding heads polish the two faces of parts an the some time, the reciprocating motion of workbench is finished by Z axis.
This machine is used in the double face grinding of single-crystal or crystal silicon in solar energy industry; it can achieve the goal of rough or accurate grinding in the parts’ faces, this machine has the characteristic of high automaticity and satisfied the requirements of medium duty or mass production, This machine compass the parts by air-operated from SMC, it is convenient and stable to clamp the parts, so that to ensure the accuracy of the parts.
The bed, pulley stock, loading carriage and feeding carriage are castings, which has the characteristic of good stiffness and good seismic, the control system uses the system of Mitsubishi, it has the characteristic of strong programming function, easy operation, and it can satisfied different machining requirements. It equips laser instrument, it can ensure the different quite high requirements of the parts machining accuracy, so that to satisfied the requirement of volume production., and it equips the water protection switch and electronic handwheel.

Technological Process:
The machine automatically feed and cruse & fine grinding with the same specification, every time of clamping, automatically center and pressing,

Equipment Technique parameter:
1 Equipment Input Parameter:
(1)Processing part name : crystal silicon square stock
(2)Status before processing: four faces of crystal silicon square stock
(3) Processing Size: 125×125/156×156/210×210mm
(4) Processing Length：Max500mm；
(5) Continuous Working Time：24H；
(6) Methods of loading materials：Hand；
(7) Abrasion Wheel Motor：5.5Kw，3000r/min；
(8) Linear speed of wheel：35.3m/s；
(9) Loading speed of beds：0.01～5m/min；
(10) Abrasion Wheel Specification：Ф200 × 80 ×50 mm；
(11)Abrasion wheel fineness：rough grinding：230，accurate grinding: 1000
Diamond wheel，accurate grinding: 1000；
(12) machine weight：8000kg.

2processing accuracy：（silicon rods size:156×156）
Parallelism of Two Faces：0.02mm
          Perpendicularity：0.02mm
          Size Error：0.02mm
Roughness：Ra≤0.1μm

3 Process Capacity： 13min/pcs（silicon rods 156×156×300）

 Equipment Service Conditions：
(1) Power Source：380V±5%，F(xiàn)requency 50Hz±10%，three-phrase and five-wire system；
(2) Gross Power：40Kw；
(3) Water Source：G1/2＂tap water，water pressure0.25~0.3 Mpa；
(4) maximum water supply volume：10L/min；
(5) gas source：φ1２mm compressed air inlet，pressure≥0.5Mpa；
(6) Maximum gas supply volume：50L/min；
(7) mist exhaust connecter:Φ155mm ；
(8) mist exhaust volume：≥1000m3/h；
(9) basic requirement：cement floor≥400mm；
(10) machine size：about4200mm×2200mm×2400mm；
(11) environment temperature：20°C~30°C；
(12) relative humidity：<75%；
(13)drainage piping：out-diameter size of pipe2×G3“effluent；
(14) maximum displacement：2m3/h；
(15) noise：<75dB；